Anagram:	DB
Family:	DSBGA
Description:	Die Size Ball Grid Array. DSBGA is a type of BGA package where the body size is defined to coincide as closely as possible with a specific die size. These packages are sometimes called CSP packages. The solder balls consist of eutectic lead/ tin solder.

Device   Carrier Width Carrier Pitch QTY on 330mm Body Width Body Length Body Thickness Lead Pitch Anagram A (Width) B (Length) K (Depth) DSBGA-0.95x0.95-0.40 /2x2 Tape and Reel Service 8 4 0 0.95 0.95 1.00 0.40 DB 0.95 0.95 1.20 DSBGA-1.35x1.35-0.40 /3x3 Tape and Reel Service 8 4 0 1.35 1.35 1.00 0.40 DB 1.35 1.35 1.20 DSBGA-3.50x4.50-1.00 (3x4) Tape and Reel Service 0 0 0 3.50 4.50 1.00 0.50 DB 3.50 4.50 1.00