CC CCGA Ceramic Column Grid Array, Rectangular and Square Max. depth is 7.40mm. The column matrix is represented in the parantheses. Nominal solder column diameter is 0.55mm for 1.50 and 1.27mm pitches, and is 0.51mm for 1.00mm pitch. CE CERDIP This CDIP is dry pressed ceramic hermetically sealed around a dip formed leadframe. CG CPGA Ceramic Pin Grid Array CH Chips Chip Capacitors: The chips could be either Resistors or Capacitors. Bare Die: CJ CSOJ Small Outline J-Lead Ceramic Family CQ CLCC Ceramic Leadless Chip Carrier CR CERQUAD Ceramic Quad Package. They comes into lead forms: Gull Wing (Quad Flatpack package) and "J" Lead (PQCC package) CT Connectors Connector, (Receptacles are "female," and Headers are "male.") DF DFN Dual Flat No Lead Package, (DFN)-Very Thin (HP-VFDFP-N, Body Thickness-1.0 mm) and Very Very Thin (HP-WFDFP-N, Body-0.8 mm). These are also sometimes called Micro Leadframe Dual (MLPD) packages. Rectangular packages could be either Type 1 or 2 styles. DK D-Pak Diode (Surface Mount Package) DN DIP Dual In-line Package DQ DQFN Dual Compatible Thermally Enhanced Plastic Very Thin and Very Very Thin Fine Pitch Quad Flat No Lead Package Families. It is essentially a QFN package, with only two leads each on shorter edges. FE FET Field Effect Transistor, aka (Disk Button) FP Flatpack Flatpack. JEDEC Package Designator: R-GDFP-F. GD GDIP Glass Dual In-Line Package HK Heatsink A metal device utilized to extract and dissipate heat. HS HSSOP Heat Slug Small Outline Package. ID Inductor Inductor JS SOJ Small Outline "J" Lead Package. The body width is indicated in the parantheses. KD KDIP Skinny Dual In-Line Package KJ SKSJ Socket for SOJ KN PKDIP Plastic Skinny Dual In-line Package LC LDCC Leaded Chip Carrier LG LGA Land Grid Arrays LJ LSOJ Low Profile Small Outline J-lead Package (LSOJ). JEDEC Designation: PRSO-J/LSOJ. Max. Depth is 2.05 mm LL LLCC Leadless Chip Carrier LT LTCC Low-temperature co-fired ceramic MCM MS MSOP Micro SOIC Packages. The body width is indicated in the parantheses. MSOP-08 (2.30) is also sometimes known as TSOP2-08 (2.30) package. OC Optocoupler Optocouplers. OF Odd-Form Odd-Form Devices OS Oscillator Oscillator: A circuit or device that produces an alternating current of a specific frequency at its output terminals. PD PDIP Plastic Dual In-line Package PF PFP Plastic Flatpacks PG PGA Pin Grid Arrays PQ PQCC Plastic Lateral Chip Carrier. The standard lead pitch on each is 1.27 mm. QC LCC Leadless Chip Carrier: There are four types of LCCs based on terminals and their locations: A, B, C, and D. The type is indicated in the device name in parantheses. The commonly used LCC is the "C" kind. QF QFP Quad Flatpack, a package with leads on all four sides. It can be ceramic, metal or plastic; bumpered. Devices are named for their body width, length, and thickness, (none include leads), followed by their lead pitch and version, if applicable. QN QFN Quad Flat No Lead Packages (QFN) or VQFN Very Thin, or Micro Leadframe Quad (MLPQ)-Very Thin (HP-VQFP-N, Thickness-1.0 mm), Very Very Thin (HP-WFQFP-N,-Thickness-0.8 mm), Ultra Thin-0.65, Extremely Thin-0.5mm) QS QSOP Quarter-size Small Outline Package, [See: SSOP]. The body width is indicated in the parantheses. QT TQFN Thermally Enhanced Plastic Thin Fine Pitch Quad Flat No Lead Package. This is a QFN device, with double row of leads in some cases.The fourth character after the "/" in the JEDEC designator field denotes the #of rows: A - Single Row & B- Double Row QV QVSOP Quarter-size Very Small Outline Package. RL Relay Relay SA SMC's Super Miniature Case Rectifiers. These are two leaded C-bend devices. They are primarily used in Diode and Rectifer applications. JEDEC designator: R-PDSO-C2 SD SOD Small Outline Diodes SG SMCGs Super Miniature Case Rectifiers. These are essentially SMCs, but with gull wings as opposed C-bend leads. They are primarily used in Diode and Rectifer applications. JEDEC designator: R-PDSO-G2 SH Switch Switch SI SIP Single In-line Package SK SKPQ Socket for PQCC SO SOIC Small Outline Integrated Circuit. SOIC-08 (5.30) and SOIC-16 (4.57) are not JEDEC approved package styles, but nonetheless are commonly used. SQ SQFN Plastic Quad No-Lead Staggered Multi-Row Packages. JEDEC Designator-HP-WFQFP-N & HP-UFQFP-N. They come in three styles: 2-row without ring, 2-row with ring, and 3-row without ring. The number of leads are maximum leads; depopulation is allowed. SS SSOP Shrink Small Outline Package. The body width is indicated in the parantheses. [Note: SSOP-36 (5.3) is not a JEDEC approved package style, but nonetheless is commonly used]. ST SOT Small Outline Transistor. SOT-143 has multiple pitches: 1.92 & 1.72 mm. Leads to right on SOT-089 Down on SOT-223 TC Tant Cap. Tantalum Capacitors TF Transformer Transformers TH TSOP1 Thin Small Outline Pkg. 1.0mm Thick, Type 1 has leads extending from the top & bottom ends. The body width is indicated after the "/" in the device name. TJ TSOJ Thin Small Outline J-Lead (TSOJ) Package. The depth and body thickness are maximum dimensions, whereas the others are nominal dimenions. TN TSOP2 Thin Small Outline Pkg. 1.0mm Thick, Type II leads extend from the sides, much like an SOIC. Multiple lead types, (like -40/44), have leads missing from the center on each side. TO Transistor Transistors, (TO-220's, T-550, Etc.) TS TSSOP Thin Shrink Small Outline Package, These Devices are 1.0mm Thick. The body width is indicated in the parantheses. TT TFSON Plastic Thin Shrink Fine Pitch Small Outline No Lead Package. These are essentially TSSOP packages without leads. UN USON Ultra-Thin Small Outline No-Lead Package. JEDEC-30 Designator: R-PDSO-N XT Crystal Crystal us a generic term used in place of the more complete expression "piezoelectric quartz crystal unit." ZP Zip Zip-Zag In-line package. Similar to a SIP, but the leads are in a zip-zag configuration